Data Sheet

ADM4850 to ADM4857

Rev. F | Page 15 of 16

OUTLINE DIMENSIONS

Figure 31. 8-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-8)

Dimensions shown in millimeters and (inches)

Figure 32. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

Figure 33. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AA

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

8

5

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

PIN 1

INDICATOR

(R 0.15)