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TOP252MN 데이터시트(PDF) 45 Page - Power Integrations, Inc. |
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TOP252MN 데이터시트(HTML) 45 Page - Power Integrations, Inc. |
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45 / 50 page ![]() Rev. M 12/21 45 TOP252-262 www.power.com Notes: 1. Package dimensions conform to JEDEC specification MS-019. 2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. D, E and F are reference datums. 5. Dimensioning and tolerancing conform to ASME Y14.5M-1994. .008 (.20) .015 (.38) .300 (7.62) .390 (9.91) .240 (6.10) .260 (6.60) 10 6 15 .200 (5.08) Max .020 (.51) Min .367 (9.32) .387 (9.83) .120 (3.05) .140 (3.56) .030 (.76) .040 (1.02) .070 (1.78) BSC .300 BSC .300 (7.62) .340 (8.64 .014 (.36) .022 (.56) .125 (3.18) .145 (3.68) -E- SEATING PLANE -D- P10C SDIP-10C (M Package) PI-4648-101507 F D E .010 (.25) M ⊕ -F- SMD-8C (G Package) PI-4015b-072320 .004 (.10) .012 (.30) .036 (0.91) .044 (1.12) .004 (.10) 0 -° 8° .356 (9.05) .387 (9.83) .048 (1.22) .009 (.23) .068 (1.73) .032 (.81) .043 (1.09) .125 (3.18) .145 (3.68) -D- Notes: 1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 3. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. Pin 3 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 5. Lead width measured at package body. 6. D and E are referenced datums on the package body. .057 (1.45) .068 (1.73) (NOTE 5) E S .100 (2.54) (BSC) .372 (9.45) .240 (6.10) .388 (9.86) .260 (6.60) .010 (.25) -E- Pin 1 D S .004 (.10) ⊕ ⊕ G08C .420 .046 .060 .060 .046 .080 Pin 1 .086 .186 .286 Solder Pad Dimensions .137 (3.48) MINIMUM |
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