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EMIF02-SPK02F2 데이터시트(PDF) 5 Page - STMicroelectronics |
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EMIF02-SPK02F2 데이터시트(HTML) 5 Page - STMicroelectronics |
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5 / 7 page ![]() EMIF02-SPK01F2 5/7 Figure 10: Order code Figure 11: FLIP-CHIP Package Mechanical Data Figure 12: Foot print recommendations Figure 13: Marking EMIF yy - xxx zz Fx EMI Filter Number of lines Information Package x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm 1.07mm ± 50µm 315µm ± 50 500µm ± 10 250µm ± 10 650µm ± 50 Copper pad Diameter : 250µm recommended , 300µm max Solder stencil opening : 330µm Solder mask opening recommendation : 340µm min for 315µm copper pad diameter Dot, ST logo xx = marking yww = datecode (y = year ww = week) z = manufacturing location x y x w z w E |
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