 2017-2019 Microchip Technology Inc.

DS20005721C-page 5

HV2803/HV2903/HV2904

AC ELECTRICAL CHARACTERISTICS

Unless otherwise specified, VDD =6.0V, VSS =-6.0V, VLL =3.3V, TAMB = +25°C. Boldface specifications apply over

the full operating temperature range.

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions/Comments

Setup Time before LE/EN Rises

tSD

25

——

ns

(Note 1)

Time Width of LE/EN

tWLE

12

——

ns

(Note 1)

Clock Delay Time to Data Out

tDO

——

13.5

ns

Time Width of CLR

tWCLR

55

——

ns

(Note 1)

Setup Time Data to Clock

tSU

1.5

——

ns

(Note 1)

Hold Time Data from Clock

tH

1.5

——

ns

(Note 1)

Clock Frequency

fCLK

——

66

MHz

50% duty cycle, fDIN =(1/2)fCLK,

CDOUT =20pF (Note 1)

Clock Rise and Fall Times

tR, tF

——

50

ns

Turn-On Time

tON

——

5

μsVSIG =5V, RLOAD = 550

(see Figure 3-4)

Turn-Off Time

tOFF

——

5

Input Large-Signal Pulse Width

tPW

——

2.5

μs

VPULSE = 0V to ±100V,

measured at 90% amplitude

(see Figure 3-5) (Note 1)

Wake-up Time from Standby to

Digital Logic Normal Operation

tWU

——

10

μs

Bank Switching mode (MODE = L)

——

10

Individual Switching mode

(MODE = H) (Note 1)

Maximum VSIG Slew Rate

dv/dt

—

—

20

V/ns

(Note 1)

Analog Small-Signal Frequency

fBWS

—50

—

MHz

(Note 1)

Off Isolation

KO

—-57

-51

dB

f = 5.0 MHz,1.0 k

/15 pF load

(see Figure 3-6) (Note 1)

—-70

-65

f= 5.0 MHz, 50

 load

(see Figure 3-6) (Note 1)

Switch Crosstalk

KCR

—-70

-60

dB

f= 5.0 MHz, 50

 load

(see Figure 3-7) (Note 1)

Off Capacitance SW to GND

CSG(OFF)

—12

—

pF

VSIG = 50 mV @ 1 MHz, no load

(Note 1)

On Capacitance SW to GND

CSG(ON)

—25

—

Output Voltage Spike at SWA,

SWB

+VSPK

——

150

mV

RLOAD = 50. (see Figure 3-8)

(Note 1)

-VSPK

-150

—

—

Charge Injection

QC

—

200

—

pC

See Figure 3-9 (Note 1)

Second Harmonic Distortion

HD2

—

-68

-60

dBc

VSIG = 1.5 VPP @ 5 MHz,

50Ω load (Note 1)

—-65

-60

dBc

VSIG =1.5 VPP @ 5 MHz,

1k

/15 pF load (Note 1)

Note 1:

Specification is obtained by characterization and is not 100% tested.

TEMPERATURE SPECIFICATION

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Range

Operating Temperature Range

TA

0—

+70

°C

Storage Temperature Range

TA

-65

—

+150

°C

Maximum Junction Temperature

TJ

—

—

+125

°C

Package Thermal Resistance

Thermal Resistance, 132-Ball TFBGA

JA

—22

—

°C/W