RT9204CS datasheet(12/14 Pages) RICHTEK

12 / 14 page

RT9204

Preliminary

www.richtek-ic.com.tw

DS9204-00 February 2002

The power components and the PWM controller

should be placed firstly. Place the input capacitors,

especially the high-frequency ceramic decoupling

capacitors, close to the power switches. Place the

output inductor and output capacitors between the

MOSFETs and the load. Also locate the PWM

controller near by MOSFETs.

A multi-layer printed circuit board is recommended.

Fig.11 shows the connections of the critical

components in the converter. Note that the capacitors

CIN and COUT each of them represents numerous

physical capacitors. Use a dedicated grounding plane

and use vias to ground all critical components to this

layer. Apply another solid layer as a power plane and

cut this plane into smaller islands of common voltage

levels. The power plane should support the input

power and output power nodes. Use copper filled

polygons on the top and bottom circuit layers for the

PHASE node, but it is not necessary to oversize this

particular island. Since the PHASE node is subjected

to very high dV/dt voltages, the stray capacitance

formed between these island and the surrounding

circuitry will tend to couple switching noise. Use the

remaining printed circuit layers for small signal

routing. The PCB traces between the PWM controller

and the gate of MOSFET and also the traces

connecting source of MOSFETs should be sized to

carry 2A peak currents.

Fig. 11

LOAD

RT9204

VCC

GND

UGATE

VOUT

IQ1

IQ2

GND

PHASE

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