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PR02 데이터시트(PDF) 13 Page - Vishay Siliconix

부품명 PR02
상세설명  Power Metal Film Resistors
PDF  14 Pages
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제조업체  VISHAY [Vishay Siliconix]
홈페이지  http://www.vishay.com
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PR02 데이터시트(HTML) 13 Page - Vishay Siliconix

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Document Number: 28729
For technical questions contact: ff3dresistors@vishay.com
www.vishay.com
Revision: 24-Feb-04
13
PR01/02/03
Power Metal Film Resistors
Vishay BCcomponents
Application Information
60
90
10 3
10 2
10
1
30
0
30
60
90
f (MHz)
ϕ(deg)
n
R = 18 Ω
n
R = 20 kΩ
n
R = 1.3 kΩ
n
R = 1.5 Ω
R = 100 kΩ
n
PR03 Phase angle as a function of applied frequency.
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with the
schedule
of
“IEC publication
60115-1”,
category
LCT/UCT/56 (rated temperature range: Lower Category
Temperature, Upper Category Temperature; damp heat,
long
term,
56 days).
The
testing
also
covers
the
requirements specified by EIA and EIAJ.
The tests are carried out in accordance with IEC publication
60068-2, “Recommended basic climatic and mechanical
robustness testing procedure for electronic components”
and under standard atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
In the Test Procedures and Requirements table, tests and
requirements are listed with reference to the relevant
clauses of “IEC publications 60115-1 and 60068-2”; a short
description of the test procedure is also given. In some
instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
TEST PROCEDURES AND REQUIREMENTS
IEC
60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
TESTS IN ACCORDANCE WITH THE SCHEDULE OF IEC PUBLICATION 60115-1
4.4.1
visual examination
no holes; clean surface; no damage
4.4.2
dimensions (outline)
gauge (mm)
see Straight & Kinked Dimensions tables
4.5
resistance
applied voltage (+ 0/−10 %):
R − Rnom: max. ± 5 %
R < 10 Ω: 0.1 V
10 Ω ≤ R < 100 Ω: 0.3 V
100 Ω ≤ R < 1 kΩ: 1 V
1 kΩ ≤ R < 10 kΩ: 3 V
10 kΩ ≤ R < 100 kΩ: 10 V
100 kΩ ≤ R < 1 MΩ: 25 V
R = 1 MΩ: 50 V
4.18
20 (Tb)
resistance to soldering heat
thermal shock: 3 s; 350 °C; 3 mm from body
∆R/R max.: ± 1 % + 0.05 Ω
4.29
45 (Xa)
component solvent
resistance
isopropyl alcohol or H2O
followed by brushing
in accordance with “MIL 202 F”
no visual damage
4.17
20 (Ta)
solderability
2 s; 235 °C
good tinning; no damage
4.7
voltage proof on
insulation
maximum voltage 500 V (RMS)
during 1 minute; metal block method
no breakdown or flashover



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