PRECI-DIP SA Rue Saint-Henri 11 CH-2800 Delémont / Switzerland

PHONE

+41 (0)32 421 04 00 FAX +41 (0)32 421 04 01 E-MAIL sales@precidip.com www.precidip.com

DESIGN RULES

PRECI-DIP Spring loaded contact solutions are designed to mate to various kinds of

surfaces:

- A gold plated surface on a printed circuit board.

- A gold target pad with a SMT, a soldering tail, a solder cup or a wire termination.

In all cases, a key parameter for designing a reliable connection is the distance between

the mating surface and the base of the spring pin, commonly named “H”.

To make a reliable connection, the mating surface must be located in the working area

between H1 and H2.

For each application, we always ask for working range in order to propose the best

design to fit customer applications.

H1 / F1

H2/F2

Hnom / Fnom

Working Range

H1

H2

H init

H max

Buffer Area

Buffer Area

PRINTED CIRCUIT BOARD

A TARGET PAD