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MIC33M656 데이터시트(PDF) 39 Page - Microchip Technology

부품명 MIC33M656
상세설명  6A, Power Module Buck Converter with HyperLight Load® and I2C Interface
PDF  46 Pages
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제조업체  MICROCHIP [Microchip Technology]
홈페이지  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MIC33M656 데이터시트(HTML) 39 Page - Microchip Technology

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 2019 Microchip Technology Inc.
DS20006256A-page 39
MIC33M656
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Center Pad Width
Contact Pad Spacing
Center Pad Length
Contact Pitch
Y2
X2
1.68
0.65
MILLIMETERS
0.50 BSC
MIN
E
MAX
9.68
Contact Pad Length (X53)
Contact Pad Width (X53)
Y1
X1
1.02
0.30
NOM
C1
Contact Pad Spacing
5.68
Contact Pad to Center Pad
G6
0.20
Thermal Via Diameter
V
Thermal Via Pitch (X12)
EV
0.33
1.20
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Contact Pad to Center Pad
G5
0.20
Contact Pad to Center Pad
G4
0.45
Contact Pad to Center Pad
G3
0.45
Contact Pad to Contact Pad (X48)
G2
0.20
Contact Pad to Center Pad (X2)
G1
0.45
G7
0.30
Contact Pad to Center Pad
Y4
X4
Y3
X3
Y6
Y5
Center Pad Width (X4)
Center Pad Length (X2)
Center Pad Width
Center Pad Length
Center Pad Length
Center Pad Length
6.62
0.70
4.58
1.33
0.55
0.70
Microchip Technology Drawing C04-3272 Rev B Sheet 2 of 2
53-Lead Very Thick Plastic Quad Flat, No Lead Package (QDA) - 6x10x3.05 mm Body
[B1QFN]
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
Thermal vias are centered within each exposed pad.
3.



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