www.statschippac.com

FEATURES

• Body Sizes: 7 x 7mm to 14 x 14mm

• Package Height: 1.0mm

• Lead Counts: 32L to 128L

• Lead pitch: 0.80mm to 0.40mm

• Wide range of open tool leadframe and die pad

sizes available

• JEDEC standard compliant

• Lead-free and Green material sets available

APPLICATIONS

• ASIC

• DSP

• Gate Array

• Logic/Microprocessors/Controllers

• Multimedia, PC Chipsets

•

•

•

•

• 7 x 7mm to 14 x 14mm

•

•

•

•

• 32 to 128 lead count

•

•

•

•

• Lead pitch range from 0.80mm

to 0.40mm

DESCRIPTION

The Thin Profile Quad Flat Pack (TQFP) belongs to STATS

ChipPAC’s QFP family. At 1.0mm body thickness, the TQFP

is the thinnest package in the QFP family. This thin package

is made possible by a well controlled low loop wire bonding

process and package warpage control during the molding

process. TQFP is suitable for mainstream cost sensitive

applications where thickness and weight are premium.

TQFP

Thin Profile Quad Flat Pack