TSSP960..

www.vishay.com

Vishay Semiconductors

Rev. 1.3, 22-Jul-2021

5

Document Number: 82868

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

ASSEMBLY INSTRUCTIONS

Reflow Soldering

• Reflow soldering must be done within 72 h while stored

under a max. temperature of 30 °C, 60 % RH after

opening the dry pack envelope

• Set the furnace temperatures for pre-heating and heating

in accordance with the reflow temperature profile as

shown in the diagram. Exercise extreme care to keep the

maximum temperature below 260 °C. The temperature

shown in the profile means the temperature at the device

surface. Since there is a temperature difference between

the component and the circuit board, it should be verified

that the temperature of the device is accurately being

measured

• Handling after reflow should be done only after the work

surface has been cooled off

Manual Soldering

• Use a soldering iron of 25 W or less. Adjust the

temperature of the soldering iron below 300 °C

• Finish soldering within 3 s

• Handle products only after the temperature has cooled off

R 1.7

5.51

0.5 ± 0.15

3 x 1.27 =

3.81

2.6

7.5

7.2

4x

1.27

2.9

4

Pick and place area. TR taping

3 x 1.27 = 3.81

1.27

0.9

specifications

according to DIN

technical drawings

Not indicated tolerances ± 0.3

Pick and place area. TT taping

Footprint

(1.4)

Issue: 8; 02.09.09

16776

Drawing-No.: 6.544-5341.01-4

A

A

0.1

0.1

0.3

0.4

14