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EM4022V20WS11 데이터시트(PDF) 2 Page - EM Microelectronic - MARIN SA |
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EM4022V20WS11 데이터시트(HTML) 2 Page - EM Microelectronic - MARIN SA |
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2 / 15 page ![]() Copyright 2002, EM Microelectronic-Marin SA 2 www.emmicroelectronic.com EM4022 Typical Operating Configurations Low frequency inductive transponder . Coil1 Coil2 EM4022 V DD CPX M L GAP V SS D1 Fig. 2 Low frequency applications are those applications that can make use of the on-chip full wave rectifier bridge to rectify the incident energy. These are typically applications that use inductive coupling to transmit energy to the chip. The carrier frequency is typically less than 500 kHz. The design of the on-chip rectifier and resonance capacitor is optimized for frequencies in the order of 125 kHz. Low frequency transponders can be implemented using just a EM4022 chip and an external coil that resonates with the on-chip tuning capacitor at the required carrier frequency. An external power storage capacitor is required to maintain the supply voltage above the integrated power on reset level. In a very strong field, due to the forward resistance of the diode, the GAP input must be limited at VSS-0.3V by a schottky diode (D1) Medium frequency (13.56 MHz) inductive transponder implementation EM4022 V DD CPX M L GAP V SS D1 D2* C Fig. 3 L: coil antenna (typical value 1.35 µH). C: tuning capacitor (typical value 100 pF) Medium frequency applications are those which cannot use the integrated full wave rectifier and where the transponder power is transmitted through a coil. External microwave schottky diodes are required to rectify the carrier wave. An external power storage capacitor can be added to improve reading range. These applications allow higher data rates (64 kbit/s). Where reading rates of 500 transponders per second can be achieved High frequency RF transponder implementation. EM4022 V DD CPX M GAP V SS D1 D2* D3 Coil1 Coil2 Fig. 4 D2 in figure 2 and 3 is optional and is only used for GAP enable versions. All diodes are schottky type. High frequency applications are similar to medium frequency applications. These are typically applications that use electromagnetic RF coupling to transmit energy to the chip using carrier frequencies greater than 100 MHz. High frequency transponders can be implemented using a EM4022 chip, two or three microwave diodes and a printed antenna. High frequency RF coupled applications typically have higher reading distances (> 4 m) and Bi-frequency applications are possible by implementing a coil between coil1 and coil2 connections in the high frequency application (fig. 4). |
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