Product Dimensions

Packaging:

2000 pcs. per reel.

AB

C

D

E

Model

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Min.

MF-SMDF030

4.72

5.44

4.22

4.93

0.79

1.09

0.30

0.25

(0.186)

(0.214)

(0.166)

(0.194)

(0.031)

(0.043)

(0.012)

(0.010)

MF-SMDF050

4.72

5.44

4.22

4.93

0.79

1.09

0.30

0.25

(0.186)

(0.214)

(0.166)

(0.194)

(0.031)

(0.043)

(0.012)

(0.010)

MF-SMDF100

4.72

5.44

4.22

4.93

0.79

1.09

0.30

0.25

(0.186)

(0.214)

(0.166)

(0.194)

(0.031)

(0.043)

(0.012)

(0.010)

MF-SMDF150

4.72

5.44

4.22

4.93

0.79

1.09

0.30

0.25

(0.186)

(0.214)

(0.166)

(0.194)

(0.031)

(0.043)

(0.012)

(0.010)

MF-SMDF150/33

4.72

5.44

4.22

4.93

0.79

1.09

0.30

0.25

(0.186)

(0.214)

(0.166)

(0.194)

(0.031)

(0.043)

(0.012)

(0.010)

MF-SMDF200

4.72

5.44

4.22

4.93

0.79

1.09

0.30

0.25

(0.186)

(0.214)

(0.166)

(0.194)

(0.031)

(0.043)

(0.012)

(0.010)

MM

(INCHES)

UNIT =

Terminal material:

Electroless Ni under immersion Au

Termination pad solderability:

Standard Au finish:

Meets ANSI/J-STD-002 Category 2.

Optional Sn finish:

Meets ANSI/J-STD-002 Category 3.

Recommended Storage:

40 °C max./70 % RH max.

A

B

C

Top and Bottom View

Side View

D

E

Recommended Pad Layout

4.6 ± 0.1

(.181 ± .004)

3.4 ± 0.1

(.134 ± .004)

1.5 ± 0.05

(.059 ± .002)

1.5 ± 0.05

(.059 ± .002)

Typical Time to Trip at 23 ˚C

0.01

0.1

1

0.001

0.1

1

10

100

10

100

Fault Current (Amps)

MF-SMDF030

MF-SMDF050

MF-SMDF200

MF-SMDF150

MF-SMDF100

The Time to Trip curves

represent typical perform-

ance of a device in a

simulated application

environment. Actual

performance in specific

customer applications may

differ from these values due

to the influence of other

variables.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.