EM4170

Copyright

 2002, EM Microelectronic-Marin SA

13

www.emmicroelectronic.com

Packages

F

F

g

C2

C1

MARKING

AREA

D

A

B

e

J

K

FRONT VIEW

TOP VIEW

R

Y

X

Z

SYMBOL

MIN

TYP

MAX

X8.0

Y4.0

Z1.0

Dimensions are in mm

Dimensions are in mm

CID Package

PCB Package

C2

C1

SYMBOL

MIN

TYP

MAX

A8.2

8.5

8.8

B3.8

4.0

4.2

D5.8

6.0

6.2

e

0.38

0.5

0.62

F

1.25

1.3

1.35

g0.3

0.4

0.5

J

0.42

0.44

0.46

K

0.115

0.127

0.139

R0.4

0.5

0.6

Fig. 19

Fig. 20

Ordering Information

Part Number

Bit Coding

Cycle

Bit

Package / Die Form

Delivery Form /

Bumping

EM4170A5WW11

Manchester

32

unsawn wafer, 11mils thickness

No bump

EM4170A5WW11E

Manchester

32

unsawn wafer, 11mils thickness

Gold bumps

EM4170A5WS7

Manchester

32

sawn wafer on frame, 7mils thickness

No bump

EM4170A5WT11E

Manchester

32

die on sticky tape, 11mils thickness

Gold bumps

EM4170A5CI2LB

Manchester

32

CID package, 2 pins (length 2.5mm)

Tape

EM4170A5CB2RC

Manchester

32

PCB package

Bulk

For other packages, please contact EM Sales

Product Support

Check our Web Site under Products/RF Identification section.

Questions can be sent to

cid@emmicroelectronic.com

A special development kit exists with embedded co-crypt processor. This tool is mandatory to use authentication

command.

EM Microelectronic-Marin SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an

EM Microelectronic-Marin SA product. EM Microelectronic-Marin SA reserves the right to change the circuitry and specifications without

notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up-to-date version.

© EM Microelectronic-Marin SA, 03/02 Rev. B/424