4

Pad Layouts

Solder Reflow and Rework Recommendations

The dimension in the table below provide the recommended pad layout for each FSMD device

Pad dimensions(millimeters)

Device

A

Nominal

B

Nominal

C

Nominal

FSMD014

3.45

1.78

3.15

FSMD020

3.45

1.78

3.15

FSMD035

3.45

1.78

3.15

FSMD050

3.45

1.78

3.15

FSMD075

3.45

1.78

3.15

FSMD110

3.45

1.78

3.15

FSMD160

3.45

1.78

3.15

Solder reflow

1

Recommended reflow methods; IR , vapor phase

oven, hot air oven.

2

The FSMD014

FSMD020

FSMD035

FSMD050 FSMD075 FSMD110 and FSMD160

devices are suitable for use with wave-solder

application methods.

3

Recommended maximum paste thickness is

0.25mm.

4

Devices can be cleaned using standard industry

methods and solvents.

CAUTION:

If reflow temperatures exceed the recommended

Profile, devices may not meet the performance

requirements.

Rework:

Use standard industry practices.

Surface Mount PTC FSMD Series

FUZETEC

DB LECTRO Inc., 3600-I, boulevard Matte, Brossard, QC J4Y 2Z2