6 / 7

CODACA ELECTRONIC CO., LTD

TEL

: +86 755 89585372

FAX

: +86 755 89585280

http://www.codaca.com

E-mail: info@codaca.com

Molding Power Inductor

CSEB1030 Series

This product is not authorized for use in any application related to safety.

Specification subject to change without notice. Please check web site for latest information.

Revised: 07/14/2020

8 Soldering Specification

8.1 Reflow Profile for SMT Components

8.2 Classification of Peak Package Body Temperature (TP)

Package Thickness

Package Volume

<350 mm

3

350

～2000 mm3

>2000 mm

3

PB-Free Assembly

<1.6mm

260

℃

260

℃

260

℃

1.6

～2.5mm

260

℃

250

℃

245

℃

≥2.5mm

250

℃

245

℃

245

℃

※ Reflow is referred to standard IPC/JEDEC J-STD-020E.

480s Max.

(Time of 25℃ to peak temperature)

25

Preheat Area

TS Max.

200

℃

TS Min.

150

℃

tS

60～120s

Max. Ramp Up Rate = 3

℃/s

Max. Ramp Down Rate = 6

℃/s

TP

TL

217

℃

TC

-5

℃

tP

20～30s

tL

60～150s

T(

℃)

t(

s)

Time