74HC245DB datasheet(2/22 Pages) PHILIPS

2 / 22 page

9397 750 14502

Product data sheet

Rev. 03 — 31 January 2005

2 of 22

Philips Semiconductors

74HC245; 74HCT245

Octal bus tranceiver; 3-state

[1]

CPD is used to determine the dynamic power dissipation (PD in µW):

PD =CPD × VCC2 × fi × N+ ∑ (CL × VCC2 × fo) where:

fi = input frequency in MHz;

fo = output frequency in MHz;

CL = output load capacitance in pF;

VCC = supply voltage in V;

N = number of inputs switching;

∑ (CL × VCC2 × fo) = sum of outputs.

Ordering information

input capacitance

3.5

CI/O

input/output capacitance

CPD

power dissipation

capacitance per

transceiver

VI = GND to

VCC − 1.5 V

[1] -30

Table 1:

Quick reference data …continued

GND = 0 V; Tamb =25 °C; tr =tf = 6 ns.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 2:

Ordering information

Type number

Package

Temperature range

Name

Description

Version

74HC245N

−40 °C to +125 °C

DIP20

plastic dual in-line package; 20 leads (300 mil)

SOT146-1

74HC245D

−40 °C to +125 °C

SO20

plastic small outline package; 20 leads;

body width 7.5 mm

SOT163-1

74HC245PW

−40 °C to +125 °C

TSSOP20

plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

SOT360-1

74HC245DB

−40 °C to +125 °C

SSOP20

plastic shrink small outline package; 20 leads;

body width 5.3 mm

SOT339-1

74HC245BQ

−40 °C to +125 °C

DHVQFN20

plastic dual-in-line compatible thermal enhanced

very thin quad ﬂat package no leads; 20 terminals;

body 2.5

× 4.5 × 0.85 mm

SOT764-1

74HCT245N

−40 °C to +125 °C

DIP20

plastic dual in-line package; 20 leads (300 mil)

SOT146-1

74HCT245D

−40 °C to +125 °C

SO20

plastic small outline package; 20 leads;

body width 7.5 mm

SOT163-1

74HCT245PW

−40 °C to +125 °C

TSSOP20

plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

SOT360-1

74HCT245DB

−40 °C to +125 °C

SSOP20

plastic shrink small outline package; 20 leads;

body width 5.3 mm

SOT339-1

74HCT245BQ

−40 °C to +125 °C

DHVQFN20

plastic dual-in-line compatible thermal enhanced

very thin quad ﬂat package no leads; 20 terminals;

body 2.5

× 4.5 × 0.85 mm

SOT764-1

74HC245DB 데이터시트(PDF) 2 Page - NXP Semiconductors

74HC245DB 데이터시트(HTML) 2 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

데이터시트 다운로드

링크 URL