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M24M01-DF 데이터시트(PDF) 39 Page - STMicroelectronics |
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M24M01-DF 데이터시트(HTML) 39 Page - STMicroelectronics |
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39 / 47 page ![]() DocID12943 Rev 14 39/47 M24M01-R M24M01-DF Package information 46 e2 - 0.500 - - 0.0197 - e3 - 0.500 - - 0.0197 - F - 0.425 - - 0.0167 - G - 0.789 - - 0.0311 - aaa - 0.110 - - 0.0043 - bbb - 0.110 - - 0.0043 - ccc - 0.110 - - 0.0043 - ddd - 0.060 - - 0.0024 - eee - 0.060 - - 0.0024 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 19. WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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