L8150 datasheet(35/37 Pages) STMICROELECTRONICS

35 / 37 page

L8150

Package information

35/37

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: http://www.st.com.

Figure 36.

SO-28 Mechanical data & package dimensions

SO-28

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

2.65

0.104

0.1

0.3

0.004

0.012

0.35

0.49

0.014

0.019

0.23

0.32

0.009

0.013

0.5

0.020

° (typ.)

17.7

18.1

0.697

0.713

10.65

0.394

0.419

1.27

0.050

16.51

0.65

7.4

7.6

0.291

0.299

0.4

1.27

0.016

0.050

° (max.)

OUTLINE AND

MECHANICAL DATA

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