PACKAGE OUTLINE

4226290/A 09/2020

www.ti.com

B3QFN - 4.05 mm max height

PLASTIC QUAD FLAT PACK- NO LEAD

RDF0022A

A

0.08 C

7.6

7.4

4.05

3.95

SEATING PLANE

PIN 1 INDEX AREA

C

(0.13) TYP

PIN 1 ID

B

6.6

6.4

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

22X (0.125)

14X 1.1

0.9

2X 6.5

22X (0.15)

20X 0.65

2X 0.75

2X 2.25

4X 1.1

0.9

4X 0.95

0.85

14X 0.3

0.2

4X 3.4

3.2

0.1

C A B

0.05

C

1

9

10

18

19

20

21

22

0.1 C A B

4X 1.3

1.1

0.1

C A B

0.05

C

(0.6)

(0.4)