in the same direction. This prevents magnetic field reversal caused by the traces between the two half-cycles

and reduces radiated EMI.

12.2 Layout Example

GND

2

1IN

±

3

4

DTC

CT

RT

7

GND

8

9

E1

10

E2

11

C2

12

VCC

13

14

REF

15

2IN±

16

2IN+

FEEDBACK

1IN+

C1

OUTPUT

CTRL

1

VIA to Power Plane

Power or GND Plane

VIA to GND Plane

LEGEND

6

5

VCC

Figure 12-1. Operational Amplifier Board Layout for Noninverting Configuration

13 Device and Documentation Support

13.1 Trademarks

All trademarks are the property of their respective owners.

13.2 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

13.3 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser based versions of this data sheet, refer to the left hand navigation.

www.ti.com

TL494

SLVS074I – JANUARY 1983 – REVISED JULY 2022

Copyright © 2022 Texas Instruments Incorporated

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