4

High

High

DH AS

Efficiency

Performance

AlGaAs

Red and

Green and

Parameter

Red

Orange

Yellow

Emerald Green

Units

30

30

20

30

mA

500

500

500

500

mA

(10

µsec Pulse)

Reverse Voltage (Ir = 100

µA)

5

555

V

LED Junction Temperature

110

110

110

110

°C

Operating Temperature Range

–20 to +100

–55 to +100

–20 to +100

°C

Storage Temperature Range

–55 to +100

°C

Wave Soldering Temperature

250

°C for 3 seconds

[1.59 mm (0.063 in.) from body]

Lead Solder Dipping Temperature

260

°C for 5 seconds

[1.59 mm (0.063 in.) from body]

Notes:

1. See Figure 5 for maximum current derating vs. ambient temperature.

2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.

Package Dimensions

HLMP-Cx15 and HLMP-Cx23

HLMP-Cx17

1.14

± 0.20

(0.045

± 0.008)

5.80

± 0.20

(0.228

± 0.008)

5.00

± 0.20

(0.197

± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)

MIN.

8.71

± 0.20

(0.343

± 0.008)

2.54

± 0.38

(0.100

± 0.015)

0.50

± 0.10

(0.020

± 0.004)

SQ. TYP.

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. LEADS ARE MILD STEEL, SOLDER DIPPED.

3. AN EPOXY MENISCUS MAY EXTEND ABOUT

0.5 mm (0.020 in.) DOWN THE LEADS.

CATHODE

LEAD

1.85 (0.073)

MAX.

CATHODE

FLAT

(NOTE 1)

1.14

± 0.20

(0.045

± 0.008)

5.80

± 0.20

(0.228

± 0.008)

5.00

± 0.20

(0.197

± 0.008)

31.60

(1.244)

MIN.

0.70 (0.028)

MAX.

1.00

(0.039)

MIN.

8.71

± 0.20

(0.343

± 0.008)

2.54

± 0.38

(0.100

± 0.015)

0.50

± 0.10

(0.020

± 0.004)

SQ. TYP.

CATHODE

LEAD

CATHODE

FLAT

1.50

± 0.15

(0.059

± 0.006)

12.60

± 0.18

(0.496

± 0.007)