 2020 Microchip Technology Inc.

DS20006433A-page 23

UCS3205

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

3.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Microchip Technology Drawing C04-1273 Rev A Sheet 2 of 2

19-Lead Very Thin Plastic Quad Flat, No Lead Package (Q8A) - 3x3x0.9 mm Body [VQFN]

With Dual Exposed Pads

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

0.50 BSC

0.203 REF

1.165

0.30

0.18

-

0.00

0.23

0.30

1.265

-

0.02

3.00 BSC

MILLIMETERS

MIN

NOM

19

1.365

0.40

0.35

0.90

0.05

MAX

K1

0.31 REF

Terminal-to-Exposed-Pad

Overall Length

Exposed Pad Length

D

D2

0.615

3.00 BSC

0.715

0.815

K2

0.74 REF

Terminal-to-Exposed-Pad

K3

0.40 REF

Terminal-to-Exposed-Pad