UPD301ASLASHKYX datasheet(26/40 Pages) MICROCHIP

부품명	UPD301A/KYX

상세설명	Stand-alone USB Type-C™ Power Delivery 3.0 Controller

PDF	40 Pages

Scroll/Zoom	100%

제조업체	MICROCHIP [Microchip Technology]

홈페이지	http://www.microchip.com

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26 / 40 page

UPD301A

DS00002838B-page 26

 2018-2019 Microchip Technology Inc.

5.3

Package Thermal Specifications

FIGURE 5-1:

SUPPLY RISE TIME MODEL

TABLE 5-1:

PACKAGE THERMAL PARAMETERS

Parameter

Symbol

°C/W

Thermal Resistance Junction to Ambient (@ 0 air flow)

JA

36.6

Thermal Resistance Junction to Top of Case

JC

9.2

Thermal Resistance Junction to Board

JB

15.7

Thermal Resistance Junction to Bottom of Case (@ 0 air flow)

JT

0.2

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.

TABLE 5-2:

POWER DISSIPATION

Parameter

Symbol

Max

Units

Power Dissipation

Pdis

214

Note:

This is the worst-case power dissipation as a consequence of maximum loading (before current-limiting

protections take effect) upon the VCONN power switch, 3.3V power-ORing switch, analog blocks, and core

digital logic.

t10%

10%

90%

Voltage

tRT

t90%

Time

100%

3.3V

VSS

VDD33_IO_IN

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