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STM32H7B3AI 데이터시트(PDF) 218 Page - STMicroelectronics

부품명 STM32H7B3AI
상세설명  32-bit Arm® Cortex®-M7 280 MHz MCUs, 2-Mbyte flash memory, 1.4-Mbyte RAM, 46 com. and analog interfaces, SMPS, crypto
PDF  238 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
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STM32H7B3AI 데이터시트(HTML) 218 Page - STMicroelectronics

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Table 142. UFBGA(176+25) - Mechanical data
Symbol
millimeters
inches (1)
Min.
Typ.
Max.
Min.
Typ.
Max.
A(2)
-
-
0.60
-
-
0.0236
A1
0.05
0.08
0.11
0.0020
0.0031
0.0043
A2
-
0.45
-
-
0.0177
-
A3
-
0.13
-
-
0.0051
-
A4
-
0.32
-
-
0.0126
-
b
0.24
0.29
0.34
0.0094
0.0114
0.0134
D
9.85
10.00
10.15
0.3878
0.03937
0.3996
D1
-
9.10
-
-
0.3583
-
E
9.85
10.00
10.15
0.3878
0.03937
0.3996
E1
-
9.10
-
-
0.3583
-
e
-
0.65
-
-
0.0256
-
F
-
0.45
-
-
0.0177
-
ddd
-
-
0.08
-
-
0.0031
eee (3)
-
-
0.15
-
-
0.0059
fff(4)
-
-
0.05
-
-
0.0020
1. Values in inches are converted from mm and rounded to four decimal digits.
2. Ultra thin profile: 0.50 < A Max \u0001 0.65 mm / Fine pitch: e < 1.00 mm. The total profile height (Dim.A) is measured from
the seating plane “C” to the top of the component.
3. The tolerance of position that controls the location of the pattern of balls with respect to datum A and B. For each ball there
is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datum A and B as
defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.
4. The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball
there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis
perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained
entirely in the respective zone eee above The axis of each ball must lie simultaneously in both tolerance zones.
Figure 110. UFBGA(176+25) - Recommended footprint
Dsm
Dpad
STM32H7B3xI
UFBGA(176+25) package information
DS13139 - Rev 8
page 218/238



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