STM32H7B3AI datasheet(219/238 Pages) STMICROELECTRONICS

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Table 143. UFBGA(176+25) - Recommended PCB design rules (0.65 mm pitch BGA)

Dimension

Recommended values

Pitch

0.65 mm

Dpad

0.300 mm

Dsm

0.400 mm typ. (depends on the soldermask registration

tolerance)

Stencil opening

0.300 mm aperture diameter

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.100 mm

7.10.1

Device marking for UFBGA176+25

The following figure gives an example of topside marking versus pin 1 position identifier location.

The printed markings may differ depending on the supply chain.

Other optional marking or inset/upset marks, which depend on supply chain operations, are not indicated below.

Figure 111. UFBGA176+25 marking example (package top view)

STM32H7B3

IIK6

Y WW

Revision code

Product identification(1)

Date code

Ball 1

indentifier

Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified

and therefore not approved for use in production. ST is not responsible for any consequences resulting

from such use. In no event will ST be liable for the customer using any of these engineering samples

in production. ST’s Quality department must be contacted prior to any decision to use these engineering

samples to run a qualification activity.

7.11

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following

equation:

TJmax = TAmax + (PDmax × ΘJA)

Where:

STM32H7B3xI

Thermal characteristics

DS13139 - Rev 8

page 219/238

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