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STM8AF6366TCY 데이터시트(PDF) 109 Page - STMicroelectronics

부품명 STM8AF6366TCY
상세설명  Automotive 8-bit MCU, with up to 128-Kbyte Flash memory, data EEPROM, 10-bit ADC, timers, LIN, USART, SPI, I2C, 3 to 5.5 V
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제조업체  STMICROELECTRONICS [STMicroelectronics]
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STM8AF6366TCY 데이터시트(HTML) 109 Page - STMicroelectronics

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STM8AF6388
Package information
114
11.6
Thermal characteristics
In case the maximum chip junction temperature (TJmax) specified in Table 22: General
operating conditions is exceeded, the functionality of the device cannot be guaranteed.
TJmax, in degrees Celsius, may be calculated using the following equation:
TJmax = TAmax + (PDmax x ΘJA)
where:
TAmax is the maximum ambient temperature in ° C
ΘJA is the package junction-to-ambient thermal resistance in ° C/W
PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/Omax represents the maximum power dissipation on output pins
where:
PI/Omax = Σ (VOL * IOL) + Σ((VDD - VOH) * IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low- and high-level in the
application.
11.6.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Table 52. Thermal characteristics(1)
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP 80 - 14 x 14 mm
38
°C/W
Thermal resistance junction-ambient
LQFP 64 - 10 x 10 mm
46
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
57
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
59
Thermal resistance junction-ambient
VFQFPN 32 - 5 x 5 mm
25



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