| 전자부품 데이터시트 검색엔진 |
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ICS180-01 데이터시트(PDF) 3 Page - Renesas Technology Corp |
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ICS180-01 데이터시트(HTML) 3 Page - Renesas Technology Corp |
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3 / 10 page ![]() ICS180-01 LOW EMI CLOCK GENERATOR SSCG IDT™ / ICS™ LOW EMI CLOCK GENERATOR 3 ICS180-01 REV D 051310 External Components The ICS180-01 requires a minimum number of external components for proper operation. Decoupling Capacitor A decoupling capacitor of 0.01µF must be connected between VDD and GND on pins 6 and 3, as close to these pins as possible. For optimum device performance, the decoupling capacitor should be mounted on the component side of the PCB. Avoid the use of vias in the decoupling circuit. Series Termination Resistor When the PCB trace between the clock output and the load is over 1 inch, series termination should be used. To series terminate a 50 Ωtrace (a commonly used trace impedance) place a 33 Ωresistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20 Ω. value of these capacitors is given by the following equation: PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) The 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) To minimize EMI, the 33 Ωseries termination resistor (if needed) should be placed close to the clock output. 3) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers. Other signal traces should be routed away from the ICS180-01. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. |
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