| 전자부품 데이터시트 검색엔진 |
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ACS03K/SAMPLE 데이터시트(PDF) 3 Page - Renesas Technology Corp |
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ACS03K/SAMPLE 데이터시트(HTML) 3 Page - Renesas Technology Corp |
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3 / 3 page ![]() ACS03MS FN3064 Rev 1.00 Page 3 of 3 January 1996 Die Characteristics DIE DIMENSIONS: 68 mils x 79 mils 1730mm x 2010mm METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125k Å 1.125kÅ Metal 2 Thickness: 9k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 8k Å 1kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 110 m x 110m 4.3 mils x 4.3 mils Metallization Mask Layout ACS03MS B1 VCC B4 (12) A4 (11) Y4 (10) B3 (7) (8) (9) A3 Y1 (3) A2 (4) B2 (5) Y2 (6) (14) Y3 GND (2) (13) A1 (1) |
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