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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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ST33TPHF2XSPI 데이터시트(PDF) 21 Page - STMicroelectronics |
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ST33TPHF2XSPI 데이터시트(HTML) 21 Page - STMicroelectronics |
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21 / 35 page  6.2 Thermal characteristics of packages The table below provides the thermal characteristics of the VFQFPN32 package. Table 13. Thermal characteristics Parameter Symbol Value Recommended operating temperature range Ambient temperature TA −40 to 105 °C Case temperature TC - Junction temperature TJ −43 to 108 °C Absolute maximum junction temperature - 125 °C Maximum power dissipation - 63 mW Theta-JA, -JB and -JC Junction to ambient thermal resistance θJA(1) 35.8 at 0 lfpm (2) Junction to case thermal resistance θJC 1.48 at 0 lfpm(2) Junction to board thermal resistance θJB 13.9 at 0 lfpm(2) 1. According to JESD51-2 (still air condition). 2. Linear feet per minute. ST33TPHF2XSPI Thermal characteristics of packages DS14186 - Rev 1 page 21/35 |
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