P9235A-R Datasheet

© 2016 Integrated Device Technology, Inc

2

May 17, 2016

Absolute Maximum Ratings

These absolute maximum ratings are stress ratings only. Stresses greater than those listed in Table 3, 4 and 5 may cause permanent

damage to the device. Functional operation of the P9235A-R at absolute maximum ratings is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect long-term reliability.

Table 1. Absolute Maximum Ratings Summary (All voltages are referred to ground.)

Pins

Rating

Units

EN

¯¯ , VIN, SW_B, VBRG_IN, SW_BRG1, SW_BRG2, ISNS_H, ISNS_L, BST_BRG1, BST_BRG2, GH_BRG1,

GH_BRG2

-0.3 to 28

V

VO_5, VO_33, VIN_LDO, LED_GRN, LED_RED, VDDIO, GPIO_A4, GPIO_B2, GPIO_B3, RSVD1, RSVD2,

SCL, SDA, ILIM, LED_PAT, TS, BUZ, GL_BRG1, GL_BRG2, VSNS_IN, ISNS_IN, ISNS_OUT, VDRV_IN

-0.3 to 6

V

GND_S, GND_BRG, VSNS_GND, GND_B, EPGND

+0.3

V

LDO18

-0.3 to 2

V

Thermal Characteristics

Table 21,2,3. Package Thermal Characteristics

Symbol

Description

QFN Rating

Units

ΘJA

Thermal Resistance Junction to Ambient

28.5

C/W

ΘJC

Thermal Resistance Junction to Case

21.87

C/W

ΘJB

Thermal Resistance Junction to Board

1.27

C/W

TJ

Operating Junction Temperature

-40 to +125

C

TA

Ambient Operating Temperature

-40 to +85

C

TSTG

Storage Temperature

-55 to +150

C

TLEAD

Lead Temperature (soldering, 10s)

+300

C

Notes:

1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 85°C. Exceeding the maximum allowable power

dissipation will result in excessive die temperature, and the device will enter thermal shutdown.

2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions.

3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other

unlisted variables.

Table 3. ESD Information

Test Model

Pins

Ratings

Units

HBM

All pins

+/- 2000

V

CDM

All pins.

+/- 500

V