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P9242-R 데이터시트(PDF) 8 Page - Renesas Technology Corp

부품명 P9242-R
상세설명  Wireless Power Transmitter for 15W Applications
PDF  38 Pages
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제조업체  RENESAS [Renesas Technology Corp]
홈페이지  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

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P9242-R Datasheet
© 2018 Integrated Device Technology, Inc
8
January 16, 2018
3. Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses beyond those listed under “Absolute Maximum Ratings” might cause permanent
damage to the P9242-R. Functional operation of the P9242-R at absolute maximum ratings is not implied. Exposure to absolute maximum
rating conditions for extended periods could affect long-term reliability.
Table 2.
Absolute Maximum Ratings
Pins[a]
Rating[b]
Units
EN, VIN, SW_S, VBRG_IN, SW_BRG1, SW_BRG2, CSP, CSN, BST_BRG1, BST_BRG2, GH_BRG1,
GH_BRG2
-0.3 to 28
V
PREG, LDO33, VIN_LDO, LED1, LED2, VDDIO, SCL, SDA, ILIM/FOD, LED/Q-Fact, VCOIL, TS, BUZR,
OVP_CTL, Q_DRV1, Q_DRV2, GL_BRG1, GL_BRG2, VDEM1, IDEMI, ISNS_OUT, DRV_VIN
-0.3 to 6
V
LDO18
-0.3 to 2
V
[a] Absolute maximum ratings are not provided for reserved pins (RSV). These pins are not used in the application.
[b] All voltages are referred to ground unless otherwise noted. All GND pins and the exposed pad (EP) connected together.
Table 3.
Package Thermal Information
Symbol
Description
VFQFN Rating
Units
JA
Thermal Resistance Junction to Ambient[a], [b], [c]
27.2
C/W
JC
Thermal Resistance Junction to Case [b], [c]
18.8
C/W
JB
Thermal Resistance Junction to Board[b], [c]
1.36
C/W
TJ
Operating Junction Temperature[a], [b]
-40 to +125
C
TA
Ambient Operating Temperature[a], [b]
-40 to +85
C
TSTG
Storage Temperature
-55 to +150
C
TLEAD
Lead Temperature (soldering, 10s)
+300
C
[a] The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will
result in excessive die temperature, and the device will enter thermal shutdown.
[b] This thermal rating was calculated on a JEDEC 51-standard 4-layer board with the dimensions 76.2 x 114.3 mm in still air conditions.
[c] Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted
variables.
Table 4.
ESD Information
Test Model
Pins
Ratings
Units
HBM
All pins
±2000
V
CDM
All pins
±500
V



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