HCS138MS

FN2473 Rev 3.01

Page 9 of 10

Feb 24, 2022

Die Characteristics

DIE DIMENSIONS:

85 x 101 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 x 4 mils

Metallization Mask Layout

HCS138MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The

mask series for the HCS138 is TA14361A.

A1

A0

VCC

A2 (3)

E1 (4)

E2 (5)

E3 (6)

(8)

(9)

(10)

(11) Y4

(12) Y3

(13) Y2

(14) Y1

(2)

(1)

(16)

GND

Y6

Y5

(7)

Y0

(15)

NC

NC

Y7

NC

NC