| 전자부품 데이터시트 검색엔진 |
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HCS27MS 데이터시트(PDF) 8 Page - Renesas Technology Corp |
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HCS27MS 데이터시트(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() HCS27MS FN3054 Rev 1.00 Page 8 of 8 September 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.24mm METALLIZATION: Type: SiAl Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS27MS A1 VCC C1 B1 (2) A2 (3) B2 (4) C2 (5) (6) (7) (8) (9) A3 (10) B3 (11) C3 (12) Y1 (1) (14) (13) Y2 GND Y3 |
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