| 전자부품 데이터시트 검색엔진 |
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HCS374D 데이터시트(PDF) 10 Page - Renesas Technology Corp |
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HCS374D 데이터시트(HTML) 10 Page - Renesas Technology Corp |
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10 / 10 page ![]() HCS374MS FN2470 Rev 3.00 Page 10 of 10 November 11, 2004 Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 mils x 4 mils Metallization Mask Layout HCS374MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCS374 is TA14304B. D1 (4) Q1 (5) Q2 (6) D2 (7) (8) D3 (9) Q3 (10) GND (11) CP (12) Q4 (13) D4 (18) D7 (17) D6 (16) Q6 (15) Q5 (14) D5 Q0 (2) D0 (3) OE (1) VCC (20) Q7 (19) |
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