| 전자부품 데이터시트 검색엔진 |
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HCS86MS 데이터시트(PDF) 8 Page - Renesas Technology Corp |
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HCS86MS 데이터시트(HTML) 8 Page - Renesas Technology Corp |
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8 / 8 page ![]() HCS86MS FN3058 Rev 1.00 Page 8 of 8 September 1995 Die Characteristics DIE DIMENSIONS: 87 x 88 mils 2.20 x 2.24mm METALLIZATION: Type: AlSi Metal Thickness: 11k Å 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å 2.6kÅ WORST CASE CURRENT DENSITY: <2.0 x 105A/cm2 BOND PAD SIZE: 100 m x 100m 4 x 4 mils Metallization Mask Layout HCS86MS A1 VCC B4 B1 (2) Y1 (3) A2 (4) B2 (5) (6) (7) (8) (9) A3 (10) B3 (11) Y4 (12) A4 (1) (14) (13) Y2 GND Y3 |
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