HCTS191MS

FN2250 Rev 2.00

Page 10 of 10

September 1995

Die Characteristics

DIE DIMENSIONS:

104 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

< 2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 x 4 mils

Metallization Mask Layout

HCTS191MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCTS191 is TA14447A.

Q1

P1

VCC

Q0 (3)

CE (4)

U/D (5)

Q2 (6)

(9)

(10)

(11) PL

(12) TC

(13) RC

(2)

(1)

(16)

P3

P2

(8)

GND

(14) CP

Q3 (7)

(15) P0