HCTS240AMS

FN2105 Rev 2.00

Page 10 of 10

September 1995

Die Characteristics

DIE DIMENSIONS:

106mils x 108mils

2.68mm x 2.74mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å  2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

m x 100m

4 mils x 4 mils

Metallization Mask Layout

HCTS240AMS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask

series for the HCTS240A is TA14400B.

1 A1 (4)

2 Y2 (5)

1 A2 (6)

2 Y1 (7)

(18) 1 Y0

(17) 2 A3

(16) 1 Y1

(15) 2 A2

(14) 1 Y2