FN3018 Rev 5.00

Page 14 of 14

November 2000

HIP0080, HIP0081

Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted

in the quality certifications found at www.intersil.com/en/support/qualandreliability.html

Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such

modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are

current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its

subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

For additional products, see www.intersil.com/en/products.html

© Copyright Intersil Americas LLC 2000. All Rights Reserved.

All trademarks and registered trademarks are the property of their respective owners.

Plastic Leaded Chip Carrier Packages (PLCC)

NOTES:

1. Controlling dimension: INCH. Converted millimeter dimensions are

not necessarily exact.

2. Dimensions and tolerancing per ANSI Y14.5M-1982.

3. Dimensions D1 and E1 do not include mold protrusions. Allowable

mold protrusion is 0.010 inch (0.25mm) per side. Dimensions D1

and E1 include mold mismatch and are measured at the extreme

material condition at the body parting line.

4. To be measured at seating plane

contact point.

5. Centerline to be determined where center leads exit plastic body.

6. “N” is the number of terminal positions.

-C-

A1

A

SEATING

PLANE

0.020 (0.51)

MIN

VIEW “A”

D2/E2

0.025 (0.64)

0.045 (1.14)

R

0.042 (1.07)

0.056 (1.42)

0.050 (1.27) TP

E

E1

0.042 (1.07)

0.048 (1.22)

PIN (1) IDENTIFIER

CL

D1

D

0.020 (0.51) MAX

3 PLCS

0.026 (0.66)

0.032 (0.81)

0.045 (1.14)

MIN

0.013 (0.33)

0.021 (0.53)

0.025 (0.64)

MIN

VIEW “A” TYP.

0.004 (0.10)

C

-C-

D2/E2

CL

N28.45 (JEDEC MS-018AB ISSUE A)

28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.165

0.180

4.20

4.57

-

A1

0.090

0.120

2.29

3.04

-

D

0.485

0.495

12.32

12.57

-

D1

0.450

0.456

11.43

11.58

3

D2

0.191

0.219

4.86

5.56

4, 5

E

0.485

0.495

12.32

12.57

-

E1

0.450

0.456

11.43

11.58

3

E2

0.191

0.219

4.86

5.56

4, 5

N28

28

6

Rev. 2 11/97