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HIP6016 데이터시트(PDF) 13 Page - Renesas Technology Corp |
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HIP6016 데이터시트(HTML) 13 Page - Renesas Technology Corp |
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13 / 14 page ![]() FN4566 Rev 1.00 Page 13 of 14 January 1999 HIP6016 Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com For additional products, see www.intersil.com/en/products.html © Copyright Intersil Americas LLC 1999-2002. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. MOSFET Selection/Considerations The HIP6016 requires 3 N-Channel power MOSFETs. Two MOSFETs are used in the synchronous-rectified buck topology of the PWM converter. The linear controller drives a MOSFET as a pass transistor. These should be selected based upon rDS(ON), gate supply requirements, and thermal management requirements. PWM MOSFET Selection and Considerations In high-current PWM applications, the MOSFET power dissipation, package selection and heatsink are the dominant design factors. The power dissipation includes two loss components; conduction loss and switching loss. These losses are distributed between the upper and lower MOSFETs according to duty factor (see the equations below). The conduction loss is the only component of power dissipation for the lower MOSFET. Only the upper MOSFET has switching losses, since the lower device turns on into near zero voltage. The equations below assume linear voltage-current transitions and do not model power loss due to the reverse-recovery of the lower MOSFETs’ body diode. The gate-charge losses are proportional to the switching frequency (FS) and are dissipated by the HIP6016, thus not contributing to the MOSFETs’ temperature rise. However, large gate charge increases the switching interval, tSW which increases the upper MOSFET switching losses. Ensure that both MOSFETs are within their maximum junction temperature at high ambient temperature by calculating the temperature rise according to package thermal resistance specifications. A separate heatsink may be necessary depending upon MOSFET power, package type, ambient temperature and air flow. The rDS(ON) is different for the two previous equations even if the type device is used for both. This is because the gate drive applied to the upper MOSFET is different than the lower MOSFET. Figure 14 shows the gate drive where the upper gate- to-source voltage is approximately VCC less the input supply. For +5V main power and +12VDC for the bias, the gate-to- source voltage of Q1 is 7V. The lower gate drive voltage is +12VDC. A logic-level MOSFET is a good choice for Q1 and a logic-level MOSFET can be used for Q2 if its absolute gate-to- source voltage rating exceeds the maximum voltage applied to VCC. Rectifier CR1 is a clamp that catches the negative inductor voltage swing during the dead time between the turn off of the lower MOSFET and the turn on of the upper MOSFET. The diode must be a Schottky type to prevent the lossy parasitic MOSFET body diode from conducting. It is acceptable to omit the diode and let the body diode of the lower MOSFET clamp the negative inductor swing, but efficiency might drop one or two percent as a result. The diode’s rated reverse breakdown voltage must be greater than twice the maximum input voltage. Linear Controller MOSFET Selection The main criteria for selection of a MOSFET for the linear regulator is package selection for efficient removal of heat. The power dissipated in a linear regulator is: Select a package and heatsink that maintains the junction temperature below the maximum rating while operating at the highest expected ambient temperature. PUPPER IO 2 rDS ON VOUT VIN ------------------------------------------------------------------ IO VIN tSW FS 2 -------------------------------------------------------- + = PLOWER IO 2 rDS ON VIN VOUT – VIN --------------------------------------------------------------------------------------- = +12V PGND HIP6016 GND LGATE UGATE PHASE VCC +5V OR LESS NOTE: NOTE: VGS VCC Q1 Q2 + - FIGURE 14. OUTPUT GATE DRIVERS VGS VCC -5V CR1 PLINEAR IO VIN VOUT – = |
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