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HIP6016 데이터시트(PDF) 13 Page - Renesas Technology Corp

부품명 HIP6016
상세설명  Advanced PWM and Dual Linear Power Control
PDF  14 Pages
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제조업체  RENESAS [Renesas Technology Corp]
홈페이지  http://www.renesas.com
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FN4566 Rev 1.00
Page 13 of 14
January 1999
HIP6016
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
For additional products, see www.intersil.com/en/products.html
© Copyright Intersil Americas LLC 1999-2002. All Rights Reserved.
All trademarks and registered trademarks are the property of their respective owners.
MOSFET Selection/Considerations
The HIP6016 requires 3 N-Channel power MOSFETs. Two
MOSFETs are used in the synchronous-rectified buck topology
of the PWM converter. The linear controller drives a MOSFET
as a pass transistor. These should be selected based upon
rDS(ON), gate supply requirements, and thermal management
requirements.
PWM MOSFET Selection and Considerations
In high-current PWM applications, the MOSFET power
dissipation, package selection and heatsink are the dominant
design factors. The power dissipation includes two loss
components; conduction loss and switching loss. These losses
are distributed between the upper and lower MOSFETs
according to duty factor (see the equations below). The
conduction loss is the only component of power dissipation for
the lower MOSFET. Only the upper MOSFET has switching
losses, since the lower device turns on into near zero voltage.
The equations below assume linear voltage-current transitions
and do not model power loss due to the reverse-recovery of
the lower MOSFETs’ body diode. The gate-charge losses are
proportional to the switching frequency (FS) and are dissipated
by the HIP6016, thus not contributing to the MOSFETs’
temperature rise. However, large gate charge increases the
switching interval, tSW which increases the upper MOSFET
switching losses. Ensure that both MOSFETs are within their
maximum junction temperature at high ambient temperature by
calculating the temperature rise according to package thermal
resistance specifications. A separate heatsink may be
necessary depending upon MOSFET power, package type,
ambient temperature and air flow.
The rDS(ON) is different for the two previous equations even if
the type device is used for both. This is because the gate drive
applied to the upper MOSFET is different than the lower
MOSFET. Figure 14 shows the gate drive where the upper gate-
to-source voltage is approximately VCC less the input supply.
For +5V main power and +12VDC for the bias, the gate-to-
source voltage of Q1 is 7V. The lower gate drive voltage is
+12VDC. A logic-level MOSFET is a good choice for Q1 and a
logic-level MOSFET can be used for Q2 if its absolute gate-to-
source voltage rating exceeds the maximum voltage applied to
VCC.
Rectifier CR1 is a clamp that catches the negative inductor
voltage swing during the dead time between the turn off of the
lower MOSFET and the turn on of the upper MOSFET. The
diode must be a Schottky type to prevent the lossy parasitic
MOSFET body diode from conducting. It is acceptable to omit
the diode and let the body diode of the lower MOSFET clamp
the negative inductor swing, but efficiency might drop one or
two percent as a result. The diode’s rated reverse breakdown
voltage must be greater than twice the maximum input voltage.
Linear Controller MOSFET Selection
The main criteria for selection of a MOSFET for the linear
regulator is package selection for efficient removal of heat. The
power dissipated in a linear regulator is:
Select a package and heatsink that maintains the junction
temperature below the maximum rating while operating at the
highest expected ambient temperature.
PUPPER
IO
2
rDS ON

VOUT
VIN
------------------------------------------------------------------
IO VIN
tSW
FS
2
--------------------------------------------------------
+
=
PLOWER
IO
2
rDS ON

VIN VOUT
–

VIN
---------------------------------------------------------------------------------------
=
+12V
PGND
HIP6016
GND
LGATE
UGATE
PHASE
VCC
+5V OR LESS
NOTE:
NOTE:
VGS VCC
Q1
Q2
+
-
FIGURE 14. OUTPUT GATE DRIVERS
VGS VCC -5V
CR1
PLINEAR IO VIN VOUT
–

=



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