74LVC3G07

Document number: DS44930 Rev. 2 - 2

7 of 8

www.diodes.com

November 2022

© 2022 Copyright Diodes Incorporated. All Rights Reserved.

74LVC3G07

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SSOP-8

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SSOP-8

Mechanical Data

SSOP-8



Moisture Sensitivity: Level 1 per J-STD-020



Terminals: Finish - Mate Tin Plated Leads, Solderable per MIL-STD-202, Method 208



Weight: 0.0169 grams (Approximate)

Ø 0.60mmx0.038DP

Surface Polished

L1

E1

c

1

D

A

A1

A2

E

e

0.750

0.750

C

Seating Plane

L

4x10°

4x10°

C

ccc C

D

A

B

aaa C

2x

D

bbb C

2x4 Tips

b(8x)

ddd

C A-B D

SEATING PLANE

H

See Detail C

Detail C

a

SSOP-8

Dim

Min

Max

Typ

A

--

1.30

--

A1

0.05

0.15

--

A2

0.95

1.20

1.05

b

0.15

0.30

0.225

c

0.08

0.23

--

D

2.75

3.15

2.95

E

3.75

4.25

4.00

E1

2.70

2.90

2.80

e

--

--

0.65

L

0.20

0.60

0.40

L1

0.525 0.675

0.60

a

0



8



4



aaa

0.20

bbb

0.25

ccc

0.10

ddd

0.13

All Dimensions in mm

Dimensions

Value

(in mm)

C

0.650

X

0.400

X1

2.350

Y

1.100

Y1

4.900

X

Y

C

X1

Y1