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C0603X393DZGACTU 데이터시트(PDF) 11 Page - Kemet Corporation

부품명 C0603X393DZGACTU
상세설명  High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
PDF  23 Pages
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제조업체  KEMET [Kemet Corporation]
홈페이지  http://www.kemet.com
Logo KEMET - Kemet Corporation

C0603X393DZGACTU 데이터시트(HTML) 11 Page - Kemet Corporation

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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
C1070_C0G_HV_FT-CAP_SMD • 2/28/2023
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Voltage with Flexible Termination System (HV FT-CAP), C0G Dielectric, 500 – 10,000 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/
J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes
at these conditions.
Profile Feature
Termination Finish
SnPb
100% Matte Sn
Preheat/Soak
Temperature Minimum (T
Smin)
100°C
150°C
Temperature Maximum (T
Smax)
150°C
200°C
Time (t
S) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (T
L to TP)
3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (T
L)
183°C
217°C
Time Above Liquidous (t
L)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (T
P)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (t
P)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (T
P to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
T
smin
25
T
smax
T
L
T
P
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak



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