SLG51001

PMIC with High PSRR, Low Noise, Multi-Output LDOs

and Integrated Load Switch

Datasheet

Revision 3.01

10-May-2022

CFR0011-120-00

2 of 25

© 2022 Renesas Electronics Corporation

Contents

General Description ............................................................................................................................ 1

Key Features ........................................................................................................................................ 1

Applications ......................................................................................................................................... 1

Contents ............................................................................................................................................... 2

Figures...................................................................................................... Error! Bookmark not defined.

Tables ....................................................................................................... Error! Bookmark not defined.

1

Block Diagram ............................................................................................................................... 3

2

Pinout ............................................................................................................................................. 4

2.1

Input Pins .............................................................................................................................. 5

2.1.1

CS

– Chip Select ................................................................................................... 5

2.1.2

SCL

– I2C Clock ..................................................................................................... 6

2.2

Bidirectional Pins................................................................................................................... 6

2.2.1

GPIO1 to GPIO3 and GPI4

– General Purpose Input/Output ............................... 6

2.2.2

SDA

– I2C Data ...................................................................................................... 6

3

Characteristics............................................................................................................................... 7

3.1

Absolute Maximum Ratings .................................................................................................. 7

3.1.1

Guidelines for Reliable Operation.......................................................................... 7

3.2

Recommended Operating Conditions ................................................................................... 7

3.3

Thermal Characteristics ........................................................................................................ 8

3.4

Current Consumption ............................................................................................................ 8

3.5

Chip Select Digital I/O Characteristics .................................................................................. 8

3.6

1.2 V/1.8 V Digital I/O Characteristics................................................................................. 10

3.7

LDO_HP Characteristics ..................................................................................................... 11

3.8

LDO_HV Characteristics ..................................................................................................... 13

3.9

LDO_LV Characteristics...................................................................................................... 17

3.9.1

Load Switch Mode Characteristics ...................................................................... 19

3.10 VREF, IREF, Temperature Supervision Characteristics ..................................................... 20

3.11 Internal Oscillator Characteristics ....................................................................................... 21

3.12 UVLO Characteristics.......................................................................................................... 21

4

Package Information ................................................................................................................... 22

4.1

Package Outlines ................................................................................................................ 22

4.2

PCB Landing Pattern .......................................................................................................... 23

4.3

Moisture Sensitivity Level.................................................................................................... 23

4.4

WLCSP Handling ................................................................................................................ 24

4.5

Soldering Information .......................................................................................................... 24

5

Ordering Information................................................................................................................... 25