DIMENSIONS =

MILLIMETERS

(INCHES)

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Mechanical Characteristics

2FAM-C5R - Integrated Passive & Active Device using CSP

B2

A1

A3

C3

C1

0.432 - 0.559

(0.017 - 0.022)

0.971 - 1.001

(0.038 - 0.039)

0.330 - 0.457

(0.013 - 0.018)

1.285 - 1.375

(0.051 - 0.054)

0.180 - 0.280

(0.007 - 0.011)

0.435

(0.017)

0.435

(0.017)

0.3

(0.012)

0.180 - 0.280

(0.007 - 0.011)

DIA.

0.50

(0.020)

This is a silicon-based device and is packaged using chip scale packaging technology. Solder bumps, formed on the silicon die,

provide the interconnect medium from die to PCB. The bumps are arranged on the die in a regular grid formation. The grid pitch is

0.5 mm and the dimensions for the packaged device are shown below.

“Package level” testing of the integrity of the solder joint is carried out on an independent Daisy-Chain test device. A 25-Pin Daisy

Chain component is available from Bourns for this purpose (part number 2TAD-C25R). This is a 5 x 5 array featuring 0.5 mm pitch

solder bumps. The Distance to Neutral Point (DNP) on that component is larger than that of the 2FAM-C5R and is thus deemed

suitable for Thermal Cycle testing.

“Silicon level” reliability performance is based on similarity to other integrated passive CSP devices from Bourns.

Reliability Data

Frequency Response

Frequency (MHz)

0.1

1

10

0 Volts

2.5 Volts

100

1000

10000

0

-5

-10

-15

-20

-25

-30

-35

-40

-45

-50