CEM2163

Electrical Characteristics T

A = 25 C unless otherwise noted

Parameter

Symbol

Min

Units

Off Characteristics

Drain-Source Breakdown Voltage

Zero Gate Voltage Drain Current

Gate Body Leakage Current, Forward

Gate Threshold Voltage

Static Drain-Source

On-Resistance

BVDSS

IDSS

IGSSR

IGSSF

20

15

-0.4

-1.3

-100

100

-1

m

Ω

V

nA

nA

µ

A

V

Gate Body Leakage Current, Reverse

On Characteristics c

Dynamic Characteristics d

Input Capacitance

Reverse Transfer Capacitance

Output Capacitance

Switching Characteristics d

Turn-On Delay Time

Turn-Off Fall Time

Turn-Off Delay Time

Turn-On Rise Time

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Drain-Source Diode Characteristics and Maximun Ratings

Drain-Source Diode Forward Current b

Drain-Source Diode Forward Voltage c

Test Condition

VGS = 0V, ID = -250µA

VGS(th)

RDS(on)

Ciss

Coss

Crss

td(on)

tr

td(off)

tf

Qg

Qgs

Qgd

IS

VSD

Typ

Max

-20

VDS = -12V, VGS = 0V

VGS = 12V, VDS = 0V

VGS = -20V, VDS = 0V

VGS = VDS, ID = -250µA

VGS = -4.5V, ID = -7.6A

VGS = -2.5V, ID = -6A

VDD = -6V, ID = -1A,

VGS = -4.5V, RGEN = 6Ω

VDS = -6V, ID = -7A,

VGS = -4.5V

VDS = -10V, VGS = 0V,

f = 1.0 MHz

VGS = 0V, IS = -2A

2805

505

395

20

18

89

49

40

36

178

98

31.5

3.8

8.8

41

-2

-1.2

30

22

m

Ω

pF

pF

pF

ns

ns

ns

ns

nC

nC

nC

A

V

Notes :

a.Repetitive Rating : Pulse width limited by maximum junction temperature.

b.Surface Mounted on FR4 Board, t < 10 sec.

c.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2%.

d.Guaranteed by design, not subject to production testing.

2