Sensors

Freescale Semiconductor

7

MMA6281QT

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package.

With the correct footprint, the packages will self-align when

subjected to a solder reflow process. It is always

recommended to design boards with a solder mask layer to

avoid bridging and shorting between solder pads.

The flag underneath the package is internally connected to

ground. It is not recommended for the flag to be soldered

down.

Solder areas

Pin 1 ID (non metallic)

9

12

4.25

6.0

14

1.00

0.55

Flag

Non-Solder areas