MPC750ECSLASHD datasheet(31/44 Pages) NXP

31 / 44 page

MPC750A RISC Microprocessor Hardware Speciﬁcations

System Design Information

1.7.4 Mechanical Dimensions of the MPC750

Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the MPC750, 360

CBGA package.

Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature of the MPC750

1.8 System Design Information

This section provides electrical and thermal design recommendations for successful application of the

MPC750.

DIM

MIN

MAX

MILLIMETERS

2.72

3.20

0.80

1.00

1.10

1.30

---

0.60

0.82

0.90

25.00 BSC

22.86 BSC

---

12.50

2.75

---

6.00

9.00

1.27 BSC

25.00 BSC

22.86 BSC

---

14.30

3.00

---

8.00

11.00

NOTES:

DIMENSIONS AND TOLERANCING PER ASME

Y14.5M, 1994.

DIMENSIONS IN MILLIMETERS.

DIMENSION b IS THE MAXIMUM SOLDER BALL

DIAMETER MEASURED PARALLEL TO DATUM A.

D2AND E2 DEFINE THEAREA OCCUPIED BY THE

DIE AND UNDERFILL. ACTUAL SIZE OF THIS

AREA MAY BE SMALLER THAN SHOWN. D3 AND

E3 ARE THE MINIMUM CLEARANCE FROM THE

PACKAGE EDGE TO THE CHIP CAPACITORS.

CAPACITORS MAY NOT BE PRESENT ON ALL

DEVICES.

CAUTION MUST BE TAKEN NOT TO SHORT

EXPOSED METAL CAPACITOR PADS ON

PACKAGE TOP.

0.3 A

0.15 A

0.25 A

PIN A1

INDEX

TOP VIEW

18X

0.2

0.35 A

0.15 A

B C

0.82

0.93

BOTTOM VIEW

123456789 10111213141516171819

SIDE VIEW

360X

18X

360X

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

IVE

D B

Y F

INC

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