Nexperia

RB751CS40

Schottky barrier diode

6. Ordering information

Table 3. Ordering information

Package

Type number

Name

Description

Version

RB751CS40

DFN1006-2

plastic, leadless ultra small package; 2 terminals; 0.65 mm

pitch; 1 mm x 0.6 mm x 0.48 mm body

SOD882

7. Marking

Table 4. Marking codes

Type number

Marking code

RB751CS40

F6

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VR

reverse voltage

Tj = 25 °C

-

40

V

VRRM

repetitive peak reverse

voltage

-

40

V

IF

forward current

-

120

mA

IFSM

non-repetitive peak

forward current

tp < 10 ms; square wave; Tj(init) = 25 °C

-

200

mA

Ptot

total power dissipation

Tamb ≤ 25 °C

[1] [2]

-

250

mW

Tj

junction temperature

-

150

°C

Tamb

ambient temperature

-65

150

°C

Tstg

storage temperature

-65

150

°C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Reflow soldering is the only recommended soldering method.

9. Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

[1] [2] -

-

500

K/W

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

[2] Reflow soldering is the only recommended soldering method.

RB751CS40

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© Nexperia B.V. 2021. All rights reserved

Product data sheet

7 April 2021

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