ADIS16080

Rev. 0 | Page 14 of 16

SECOND-LEVEL ASSEMBLY

The ADIS16080 can be attached to the second-level assembly

board using Sn63 (or equivalent) or an RoHS-compliant solder.

Figure 21 and Table 8 provide acceptable solder reflow profiles

for each solder type. Note that these profiles may not be the

optimum profile for the user’s application. In no case shall the

260°C limit be exceeded. It is recommended that the user develop

a reflow profile based upon the specific application. In general,

keep in mind the lowest peak temperature and shortest dwell

time above the melt temperature of the solder results in less

shock and stress to the product. In addition, evaluating the

cooling rate and peak temperature can result in a more reliable

assembly.

6.873

2×

0.5 BSC

16×

0.67 BSC

12×

1 BSC

16×

0.9315

4×

0.9315

4×

Figure 20. Second Level Assembly Pad Layout

PREHEAT

CRITICAL ZONE

TIME

RAMP-DOWN

RAMP-UP

Figure 21. Recommended Solder Reflow Profiles

Table 8.

Condition

Profile Feature

Sn63/Pb37

Pb-Free

3°C/sec max

3°C/sec max

Preheat

100°C

150°C

150°C

200°C

60 sec to

120 sec

60 sec to

150 sec

Ramp-Up Rate

3°C/sec

3°C/sec

Time Maintained Above

183°C

217°C

60 sec to

150 sec

60 sec to

150 sec

240°C +

0°C/–5°C

260°C +

0°C/–5°C

Time Within 5°C of Actual Peak

10 sec to

30 sec

20 sec to

40 sec

Ramp-Down Rate

6°C/sec max

6°C/sec max

Time 25°C to Peak Temperature

6 min max

8 min max