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MPC8347E 데이터시트(PDF) 96 Page - Freescale Semiconductor, Inc |
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MPC8347E 데이터시트(HTML) 96 Page - Freescale Semiconductor, Inc |
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96 / 108 page ![]() MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3 96 Freescale Semiconductor Thermal f Accurate thermal design requires thermal modeling of the application environment using computational fluid dynamics software which can model both the conduction cooling and the convection cooling of the air moving through the application. Simplified thermal models of the packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More detailed thermal models can be made available on request. Heat sink vendors include the following list: Aavid Thermalloy 603-224-9988 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 408-567-8082 473 Sapena Ct. #12 Santa Clara, CA 95054 Internet: www.alphanovatech.com International Electronic Research Corporation (IERC) 818-842-7277 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Table 67. Heat Sink and Thermal Resistance of MPC8347EA (PBGA) Heat Sink Assuming Thermal Grease Air Flow 29 × 29 mm PBGA Thermal Resistance AAVID 30 × 30 × 9.4 mm Pin Fin Natural Convection 13.5 AAVID 30 × 30 × 9.4 mm Pin Fin 1 m/s 9.6 AAVID 30 × 30 × 9.4 mm Pin Fin 2 m/s 8.8 AAVID 31 × 35 × 23 mm Pin Fin Natural Convection 11.3 AAVID 31 × 35 × 23 mm Pin Fin 1 m/s 8.1 AAVID 31 × 35 × 23 mm Pin Fin 2 m/s 7.5 Wakefield, 53 × 53 × 25 mm Pin Fin Natural Convection 9.1 Wakefield, 53 × 53 × 25 mm Pin Fin 1 m/s 7.1 Wakefield, 53 × 53 × 25 mm Pin Fin 2 m/s 6.5 MEI, 75 × 85 × 12 no adjacent board, extrusion Natural Convection 10.1 MEI, 75 × 85 × 12 no adjacent board, extrusion 1 m/s 7.7 MEI, 75 × 85 × 12 no adjacent board, extrusion 2 m/s 6.6 MEI, 75 × 85 × 12 mm, adjacent board, 40 mm Side bypass 1 m/s 6.9 |
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