 |
전자부품 데이터시트 검색엔진 |
|
|
전자부품 데이터시트 검색엔진 |
|
ST7260 데이터시트(PDF) 106 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
ST7260 데이터시트(HTML) 106 Page - STMicroelectronics |
|
|
106 / 117 page  ST7260 106/117 14.3 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines in Figure 66 and Figure 67. Recommended glue for SMD plastic packages dedicated to molding compound with silicone: ■ Heraeus: PD945, PD955 ■ Loctite: 3615, 3298 Figure 66. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb) Figure 67. Recommended Reflow Soldering Oven Profile (MID JEDEC) 250 200 150 100 50 0 40 80 120 160 Time [sec] Temp. [°C] 20 60 100 140 5 sec COOLING PHASE (ROOM TEMPERATURE) PREHEATING 80°C PHASE SOLDERING PHASE 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [°C] ramp up 2°C/sec for 50sec 90 sec at 125°C 150 sec above 183°C ramp down natural 2°C/sec max Tmax=220+/-5°C for 25 sec |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Korean ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
